Principal or Sr. Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design

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Job description

Requisition ID: R
Category: Engineering
Location: Linthicum - MD, United States of America
Citizenship Required: United States Citizenship
Clearance Type: Polygraph
Telecommute: No- Teleworking not available for this position
Shift: 1st Shift (United States of America)
Travel Required: Yes, 10% of the Time
Positions Available: 2

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems (NGMS) Advanced Capabilities division is leading the development of the next generation of high-performance computing. Superconducting electronics forms the core of our technology, with a focus on energy-efficient computation using our patented superconducting digital logic technology, Recipropcal Quantum Logic (RQL). On a gate-for-gate basis, RQL consumes orders of magnitude less power than CMOS while running at significantly higher clock speeds. The Advanced Capabilities division seeks experienced test engineers to develop these technologies into high-performance computing systems. You'll work in a fast-paced team environment alongside physicists, design engineers, and superconducting foundry engineers to make these technologies a reality.

Responsibilities:

Lead and contribute directly, working on design and analysis of signal integrity and electromagnetic effects in highly complex high frequency, high dynamic range mixed signal systems in an innovative research and development environment.

Perform analytical studies of electronic systems (integrated circuits, chip-level packaging, interposers, printed circuit boards, connectors, etc.) to support design tradeoffs.

Design and analysis activities include electromagnetic modeling (e.g. SSN, ISI, crosstalk, EMC/EMI), packaging parasitic estimation. Lead associated design, testing and verification efforts to ensure measured results meet desired design targets, and to continually improve simulation-measurement correlation.

Develop new test and simulation methods as necessary to support the above activities when demands exceed the state of the art. Create new design strategies where possible to support functional requirements while meeting SI, PI and EM goals. Deep understanding of RF/EMC measurement and analysis (s-parameters, eigenmodes, TDR, FFT, IF, etc.) Work closely with other domain experts performing related functional analyses (e.g. packaging design and analysis, circuit design, thermal/mechanical analysis, etc.).

Willingness to continually expand the knowledge base of the team (e.g. examine new research, relevant papers, seek applicable methodologies in adjacent applications, etc.). Coordinate related technical team activities.

Present details of work to colleagues during design reviews. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed (e.g. for reports).

This position can be filled at the Principal level OR Sr. Principal level. Qualifications for both are listed below:

Basic Qualifications for Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design:

Bachelors degree with 5 plus years experience with a wide range of CAD/simulation tools to support design and analysis (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity); 3 years with a Masters' degree; 0 years with a PhD.
More than 4 years experience with high frequency measurement techniques (VNA, TDR) for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.
Understanding of electromagnetic theory, transmission line theory, network analysis, and high speed measurement, calibration, and de-embedding techniques.
Knowledge of fundamental electrical engineering and circuit design principles.
Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
Ability to obtain and maintain a TS/SCI Security Clearance. US Citizenship is a requirement for this position.

Preferred Qualifications:

Experience with spectrum and network analyzer techniques for EMC measurements.
Experience with high speed oscilloscopes (both real-time and sampling) and other time domain instruments (e.g. BERT) for analog and digital signal characterization.
Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.) is a plus.
Familiarity with cryogenic test stands, superconductivity, mechanical CTE, is a plus.
Ability to work well in a team and independently, to adapt to changing priorities and requirements, ask questions, make recommendations, document current processes and propose value add changes.

Basic Qualifications for Sr. Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design:

Bachelors degree with 9 plus years experience with a wide range of CAD/simulation tools to support design and analysis (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity); 7 years with a Masters' degree; 4 years with a PhD.
More than 4 years experience with high frequency measurement techniques (VNA, TDR) for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.
Understanding of electromagnetic theory, transmission line theory, network analysis, and high speed measurement, calibration, and de-embedding techniques.
Knowledge of fundamental electrical engineering and circuit design principles.
Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
Ability to obtain and maintain a TS/SCI Security Clearance. US Citizenship is a requirement for this position.

Preferred Qualifications:

Experience with spectrum and network analyzer techniques for EMC measurements.
Experience with high speed oscilloscopes (both real-time and sampling) and other time domain instruments (e.g. BERT) for analog and digital signal characterization.
Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.) is a plus.
Familiarity with cryogenic test stands, superconductivity, mechanical CTE, is a plus.
Ability to work well in a team and independently, to adapt to changing priorities and requirements, ask questions, make recommendations, document current processes and propose value add changes.

Salary Range: 96600 - 145000
Salary Range 2: 119800 - 179600

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. With the continuing impacts of COVID-19 around the world, we are taking action to protect the health and well-being of our colleagues and maintain the safety of the communities where we operate. As a federal contractor, and consistent with Executive Order 14042 () we will require all newly hired employees in the United States to be fully vaccinated by January 18, 2022 or by your start date if it is after January 18th. Federal guidance allows for disability/medical and religious accommodations with respect to the vaccine requirement. Any requested accommodations must be reviewed and approved (if applicable) in advance of your start date.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.